Thermal performance package for integrated circuit chip
US5939214A · kind A · utility
20Cited by
17References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 1992 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Nov 24, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1275
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.