Resin-mold type semiconductor device
US5939792A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 8, 1997 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | Oct 8, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin-mold type semiconductor device includes a semiconductor chip, a die pad for supporting and fixing the semiconductor chip, a plurality of inner leads whose distal ends face the semiconductor chip, a plurality of outer leads integrally connected to the corresponding inner leads, bonding wires for electrically connecting distal end portions of the inner leads to terminal electrodes of the semiconductor chip, a resin-mold package for molding the die pad, the semiconductor chip, the inner leads and the bonding wires, and a highly water-absorbent insulating film made of highly water-absorbent polymer formed at least one portion of the surface of the resin-mold package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.