Process for manufacturing electronic circuits
US5940728A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 1996 |
| Grant date | Aug 17, 1999 |
| Priority date | — |
| Expiry date | May 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.