Method and apparatus for improved conditioning of polishing pads
US5941762A · kind A · utility
39Cited by
7References
20Claims
0Family size
Inventors
Key dates
| Filing date | Jan 7, 1998 |
| Grant date | Aug 24, 1999 |
| Priority date | — |
| Expiry date | Jan 7, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/003
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for conditioning the surface of a polishing pad used to polish a substrate, such as a semiconductor wafer. A conditioning apparatus uses two or more end effectors to abrade and/or remove the polishing byproducts from the surface of the pad. Different types of conditioning performance can be achieved when the end effectors are employed individually, sequentially or simultaneously during a polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.