Michael Ravkin
62Patents
14h-index
41Co-inventors
84Inventor score
Filing activity: Aug 29, 1996 → Mar 26, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6988327B2 | Methods and systems for processing a substrate using a dynamic liquid meniscus | Emerging Cross-Sectional Technologies | 110 | Expired |
| US7367345B1 | Apparatus and method for providing a confined liquid for immersion lithography | Emerging Cross-Sectional Technologies | 40 | Expired |
| US5941762A | Method and apparatus for improved conditioning of polishing pads | Performing Operations; Transporting | 39 | Expired |
| US6123607A | Method and apparatus for improved conditioning of polishing pads | Performing Operations; Transporting | 35 | Expired |
| US6272712A | Brush box containment apparatus | Electricity | 35 | Expired |
| US6954993B1 | Concentric proximity processing head | Electricity | 35 | Expired |
| US6431959B1 | System and method of defect optimization for chemical mechanical planarization of polysilicon | Electricity | 31 | Expired |
| US6733596B1 | Substrate cleaning brush preparation sequence, method, and system | Performing Operations; Transporting | 31 | Expired |
| US6770151B1 | Drying a substrate using a combination of substrate processing technologies | Electricity | 28 | Expired |
| US6290780A | Method and apparatus for processing a wafer | Emerging Cross-Sectional Technologies | 27 | Expired |
| US5868863A | Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) | Emerging Cross-Sectional Technologies | 21 | Expired |
| US5924154A | Brush assembly apparatus | Electricity | 19 | Expired |
| US6616516B1 | Method and apparatus for asymmetric processing of front side and back side of semiconductor substrates | Electricity | 18 | Expired |
| US7383843B2 | Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7252097B2 | System and method for integrating in-situ metrology within a wafer process | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6425158B2 | Apparatus for processing a wafer | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6624078B1 | Methods for analyzing the effectiveness of wafer backside cleaning | Electricity | 9 | Expired |
| US6866051B1 | Megasonic substrate processing module | Emerging Cross-Sectional Technologies | 9 | Expired |
| US7749689B2 | Methods for providing a confined liquid for immersion lithography | Emerging Cross-Sectional Technologies | 9 | Active |
| US7737097B2 | Method for removing contamination from a substrate and for making a cleaning solution | Physics | 8 | Active |
| US7007333B1 | System and method for a combined contact and non-contact wafer cleaning module | Performing Operations; Transporting | 8 | Expired |
| US7862662B2 | Method and material for cleaning a substrate | Physics | 7 | Active |
| US6949411B1 | Method for post-etch and strip residue removal on coral films | Emerging Cross-Sectional Technologies | 7 | Expired |
| US7696141B2 | Cleaning compound and method and system for using the cleaning compound | Electricity | 7 | Active |
| US7648584B2 | Method and apparatus for removing contamination from substrate | Physics | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.