Composite polish pad for CMP
US5944583A · kind A · utility
68Cited by
28References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 1997 |
| Grant date | Aug 31, 1999 |
| Priority date | — |
| Expiry date | Mar 17, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for polishing a semiconductor wafer using a polishing pad. Circumferential rings of alternating compressibility of hard and soft/sponge-like material are located in the polishing pad. The concentric rings may also be located off-center from the geometric center of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.