Semiconductor chip housing having a reinforcing plate
US5945741A · kind A · utility
56Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 1997 |
| Grant date | Aug 31, 1999 |
| Priority date | — |
| Expiry date | Mar 5, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate. Advantageously the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.