High power semiconductor device having bolt-down ceramic platform
US5949649A · kind A · utility
9Cited by
8References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 28, 1998 |
| Grant date | Sep 7, 1999 |
| Priority date | — |
| Expiry date | Apr 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power semiconductor device package in which a semiconductor chip is mounted on a ceramic platform and sealed thereon by a lid. The platform has opposing end portions which receive fasteners for directly fastening the platform and semiconductor device to a heat sink without the requirement of a separate mounting clamp. In one embodiment, metal films are provided on a surface of the platform adjacent to recesses for receiving the fasteners. The metal films function to distribute the stress of the fasteners over the surface of the end portions thereby minimizing the possibility of fracture of the ceramic platform.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.