Aluminum alloys for electronic components
US5952083A · kind A · utility
7Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 1997 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Oct 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Anodizable components for electronic packaging applications, such as substrates for printed circuit boards or ball grid array electronic packages, having conductive circuitry formed on an electrically non-conductive anodic film. To inhibit the formation of electrically conductive precipitates in the anodic film that can form an electrical short circuit between the circuit traces and the metallic core of the component, the metallic core is formed from an anodizable alloy having below thresholds of precipitate forming constituents. Such precipitate forming constituents include iron, silicon and manganese.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.