Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate
US5952247A · kind A · utility
27Cited by
6References
63Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1996 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Oct 2, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for accessing a portion of an integrated circuit formed on top of a semiconductor substrate from the bottom of the semiconductor substrate. First, alignment marks are located which are approximately aligned to the integrated circuit. These alignment marks are then used in conjunction with a circuit diagram of the integrated circuit to determine the point on the bottom of the semiconductor substrate residing beneath the portion of the integrated circuit which the practitioner desires to access. Finally, an opening is etched into the bottom of the semiconductor substrate at this point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.