Paul Winer
51Patents
11h-index
36Co-inventors
78Inventor score
Filing activity: Oct 2, 1996 → Jul 25, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6222246A | Flip-chip having an on-chip decoupling capacitor | Emerging Cross-Sectional Technologies | 55 | Expired |
| US6495454B2 | Substrate interconnect for power distribution on integrated circuits | Electricity | 42 | Expired |
| US6355950B1 | Substrate interconnect for power distribution on integrated circuits | Electricity | 33 | Expired |
| US5923086A | Apparatus for cooling a semiconductor die | Electricity | 32 | Expired |
| US5942805A | Fiducial for aligning an integrated circuit die | Emerging Cross-Sectional Technologies | 31 | Expired |
| US5854804A | Method and apparatus for synchronizing a mode locked laser with a device under test | Physics | 31 | Expired |
| US5952247A | Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate | Electricity | 27 | Expired |
| US5805421A | Semiconductor substrate having alignment marks for locating circuitry on the substrate | Electricity | 22 | Expired |
| US6617177B1 | Liquid crystal display devices having fill holes and electrical contacts on the back side of the die | Physics | 19 | Expired |
| US5963781A | Technique for determining semiconductor substrate thickness | Electricity | 18 | Expired |
| US5948217A | Method and apparatus for endpointing while milling an integrated circuit | Electricity | 18 | Expired |
| US6001703A | Method of forming a fiducial for aligning an integrated circuit die | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5976980A | Method and apparatus providing a mechanical probe structure in an integrated circuit die | Electricity | 11 | Expired |
| US6159754A | Method of making a circuit edit interconnect structure through the backside of an integrated circuit die | Electricity | 10 | Expired |
| US6355494B1 | Method and apparatus for controlling material removal from a semiconductor substrate using induced current endpointing | Electricity | 10 | Expired |
| US6275205A | Method and apparatus for displaying information with an integrated circuit device | Physics | 6 | Expired |
| US6878567B2 | Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates | Emerging Cross-Sectional Technologies | 6 | Expired |
| US6376919B1 | Circuit edit interconnect structure through the backside of an integrated circuit die | Electricity | 6 | Expired |
| US6525922B2 | High performance via capacitor and method for manufacturing same | Electricity | 6 | Expired |
| US9524681B2 | Backlight modulation over external display interfaces to save power | Physics | 5 | Active |
| US6159753A | Method and apparatus for editing an integrated circuit | Electricity | 5 | Expired |
| US6610605B2 | Method and apparatus for fabricating encapsulated micro-channels in a substrate | Electricity | 5 | Expired |
| US6122174A | Method of accessing the circuitry on a semiconductor substrate from the bottom of the semiconductor substrate | Electricity | 4 | Expired |
| US6809337B2 | Liquid crystal display devices having fill holes and electrical contacts on the back side of the die | Physics | 4 | Expired |
| US7755650B2 | Illumination modulation technique | Physics | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.