Flexible pin location integrated circuit package
US5952611A · kind A · utility
182Cited by
19References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1997 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Dec 19, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package (30) including a substrate (70) having an opening (86) and first and second surfaces(92, 94), a plurality of pads (100) disposed on the first and second surfaces (92, 94) having disposed thereon solder balls (150) electrically connected by a via (84) that provides the end-user with flexibility in the location of a power supply Pin (96) is disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.