Dual substrate package assembly coupled to a conducting member
US5953214A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1996 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | May 24, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10704
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic package assembly for being electrically connected to a conducting member (e.g., a printed circuit board) wherein the assembly includes a pair of substrates. The first substrate includes opposing circuit patterns, those on one surface being of higher density and thus adapted for having high density electronic devices mounted thereon. This high density pattern is electrically coupled to the lesser density second pattern which is connected to contacts of a second substrate. These contacts are of the lesser density also, and extend through a dielectric member for being coupled to conductors (e.g., copper circuit pads) on the conducting member. Ready separability of various parts of the assembly is thus assured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.