Semiconductor laser package with power monitoring system
US5953355A · kind A · utility
22Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1997 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Apr 2, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/183
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser package including a plastic resin housing for encapsulating a vertical cavity surface emitting laser. The semiconductor laser package including a mounting base, a surround can and a cap. The cap having integrally formed therein a power monitoring system, such as a photodetector. The vertical cavity surface emitting laser generating an emission along a path. The photodetector optically positioned to receive a portion of the emission. The power monitoring system including a plurality of layers of an amorphous silicon material and/or a germanium material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.