Bump forming method
US5953624A · kind A · utility
113Cited by
6References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 1998 |
| Grant date | Sep 14, 1999 |
| Priority date | — |
| Expiry date | Jan 12, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01033
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a bump on, for instance, an electrode of a semiconductor device out of a wire comprising the steps of forming a ball at the end of the bonding wire, pressing the ball against the electrode, and separating the ball from the wire by cutting the wire by a pair of cutters that advance toward each other along the diameter of the wire. The cut surface of the ball or the bump can be flattened by the cutters that presses the cut surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.