Hirofumi Moroe
7Patents
5h-index
10Co-inventors
49Inventor score
Filing activity: Apr 22, 1997 → Jan 17, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5953624A | Bump forming method | Electricity | 113 | Expired |
| US6687988B1 | Method for forming pin-form wires and the like | Emerging Cross-Sectional Technologies | 111 | Expired |
| US6581283B2 | Method for forming pin-form wires and the like | Emerging Cross-Sectional Technologies | 110 | Expired |
| US5848868A | Wafer conveying apparatus | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6193130A | Bump bonding apparatus | Electricity | 7 | Expired |
| US6505823B2 | Apparatus for positioning a semiconductor pellet | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6632703B2 | Method and apparatus for positioning a semiconductor pellet | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.