Apparatus and process for improved die adhesion to organic chip carriers
US5955782A · kind A · utility
7Cited by
35References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 4, 1997 |
| Grant date | Sep 21, 1999 |
| Priority date | — |
| Expiry date | Nov 4, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package and method for preparing same to obtain improved die adhesion to organic chip carriers has been developed. A copper die bond pad is coated with a passivation material and attached to an organic card with the same passivation material. A semiconductor die may be adhered to the coated die bond pad with either the same passivation material or a common die bond adhesive. Alternatively, the passivation material is coated only on the portion of the die bond pad where the die is attached, and common die bond adhesive attaches the die bond pad to the organic card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.