David Michael Passante
3Patents
3h-index
9Co-inventors
36Inventor score
Filing activity: May 29, 1996 → Mar 17, 1998
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5784260A | Structure for constraining the flow of encapsulant applied to an I/C chip on a substrate | Electricity | 17 | Expired |
| US5869356A | Method and structure for constraining the flow of incapsulant applied to an I/C chip on a substrate | Electricity | 16 | Expired |
| US5955782A | Apparatus and process for improved die adhesion to organic chip carriers | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.