Inspection system and method for leads of semiconductor devices
US5956134A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1998 |
| Grant date | Sep 21, 1999 |
| Priority date | — |
| Expiry date | Apr 28, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0813
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for transporting and inspecting, seriatim, semiconductor devices with plural prong type or solder ball type leads includes a head for transporting the semiconductor devices from one support structure, such as a tray or tube, to a second support structure, such as a tray or tape, and wherein two dimensional and three dimensional measurements of the positional accuracy of the leads is carried out during the transport process. The inspection apparatus is interposed in the transport path and includes a first optical sensor such as a CCD camera oriented to capture a two dimensional image of the semiconductor device package and compare the image with a predetermined two dimensional image store in a central processing unit (CPU). A high intensity light source, such as a laser, generates a plane of light which is reflected off of the semiconductor device leads to a second optical sensor, also comprising a CCD camera, wherein a so-called three dimensional image is generated to be compared by the CPU with predetermined or calculated positional relationships of the leads to establish coplanarity of the lead tips, or lack thereof. The system includes a sensor located such that the sem…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.