Injection molded thermal interface system
US5956229A · kind A · utility
3Cited by
10References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1998 |
| Grant date | Sep 21, 1999 |
| Priority date | — |
| Expiry date | Apr 1, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled to the circuit board, the heatpipe is thermally coupled to the integrated circuit package. The plastic mold is lightweight and relatively inexpensive to produce. The mold also provides enough structural rigidity to prevent warping of the heatpipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.