Method for reducing a transient thermal mismatch

US5956563A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Erich Klink · Schenefeld, DE
• Dietmar Schmunkamp · Schenefeld, DE
• Helmut H. Weber · Waldenbuch, DE
• Roland Frech · Esslingen am Neckar, DE
• Bernd Garben · Schenefeld, DE
• Hubert Harrer · Böblingen, DE

Key dates

• Filing date: Jan 9, 1997
• Grant date: Sep 21, 1999
• Expiry date: Jan 9, 2017

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/09701
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to a method for reducing a transient thermal mismatch between a first component and a second component which are in mechanical contact with one another. The temperature of the first component is controlled by the amount of energy dissipated thereby. The amount of energy dissipated is controlled as a function of a data pattern input into the first component which causes a certain number of gates within the component to switch per clock cycle. By determining the desired energy dissipation in terms of the number of gates which are to be switched and arranging the input data pattern accordingly, the thermal mismatch between the components may be reduced.