Method of modifying an exposed surface of a semiconductor wafer
US5958794A · kind A · utility
333Cited by
113References
60Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1996 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Aug 8, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of modifying an exposed surface of a semiconductor wafer that includes the steps of: PA1 (a) contacting the surface with a fixed abrasive article having a three-dimensional textured abrasive surface that includes a plurality of abrasive particles and a binder in the form of a pre-determined pattern; and PA1 (b) relatively moving the wafer and the fixed abrasive article to modify said surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.