Richard J. Webb
13Patents
8h-index
35Co-inventors
72Inventor score
Filing activity: Jan 13, 1992 → Dec 14, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5958794A | Method of modifying an exposed surface of a semiconductor wafer | Electricity | 333 | Expired |
| US5219462A | Abrasive article having abrasive composite members positioned in recesses | Performing Operations; Transporting | 184 | Expired |
| US5692950A | Abrasive construction for semiconductor wafer modification | Performing Operations; Transporting | 152 | Expired |
| US6007407A | Abrasive construction for semiconductor wafer modification | Performing Operations; Transporting | 61 | Expired |
| US6786810B2 | Abrasive article having a window system for polishing wafers, and methods | Performing Operations; Transporting | 27 | Expired |
| US7759050B2 | Method for manufacturing thin substrate using a laminate body | Emerging Cross-Sectional Technologies | 20 | Active |
| US6604985B2 | Abrasive article having a window system for polishing wafers, and methods | Performing Operations; Transporting | 16 | Expired |
| US7775000B2 | Modular in-wall medical services unit | Fixed Constructions | 13 | Active |
| US7449124B2 | Method of polishing a wafer | Electricity | 7 | Expired |
| US7950189B1 | Modular in-wall medical services unit | Fixed Constructions | 7 | Active |
| US6997785B1 | Wafer planarization composition and method of use | Electricity | 3 | Expired |
| US11173069B2 | Earplug with stem comprising a sleeve | Human Necessities | 0 | Active |
| US7198560B2 | Wafer planarization composition and method of use | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.