Micro electro-mechanical systems relay
US5959338A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1997 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Dec 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H9/42
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A relay device build using MEMS technology and having a semiconductor wafer base with a surface depression having a first electrically conductive surface pattern. A lower diaphragm is moveably positioned above the depression for contact and has a second electrically conductive surface pattern thereon. An upper diaphragm is positioned above the lower diaphragm, with a central electrode mounted between them to selectively attract and move a diaphragm upon application of voltage. A post connects the upper and lower diaphragms to move a diaphragm when the other is moved electrostatically. The diaphragms define a sealed region enclosing the central electrode. The surface patterns may be tapered at their perimiters to provide a contact contour allowing gradually increasing contact as the diaphragm moves toward the surface. The preferred wafer is a silicon wafer, and the diaphragms are polysilicon. The patterns are formed from highly conductive material like gold, while the outer regions are a high resistive, chemically stable material like CrsiN. The sealed region is evacuated to have a vacuum, or may be filed with an inert gas. In a preferrred embodiment, the sealed region is filled wit…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.