Semiconductor device
US5959353A · kind A · utility
23Cited by
2References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 27, 1998 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Apr 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a plastic substrate with a multilayer structure having electrically conductive lines and an embedded planar metal layer, a semiconductor chip having electrodes connected to respective lines by solder, and a sealing member of a synthetic resin adhering the semiconductor chip tightly to the plastic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.