Semiconductor package having mechanically and electrically bonded supportive elements
US5959355A · kind A · utility
9Cited by
11References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 20, 1997 |
| Grant date | Sep 28, 1999 |
| Priority date | — |
| Expiry date | Oct 20, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor package having an array of solder pads and supportive elements that are mechanically and electrically bonded to the solder pads and that do not collapse during the bonding process, wherein the supportive elements are annular.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.