Pulse laser induced removal of mold flash on integrated circuit packages
US5961860A · kind A · utility
21Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1995 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Jun 1, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/351
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A dry process to remove mold flash on integrated circuit packages (IC packages) by using pulse, short wavelength laser irradiation. The mold remnants on the surface or in holes of the lead frame can be removed by pulse laser irradiation, with the effect of thermal expansion of lead frame metals and momentum transferring from the laser beam to the mold remnants. Compared with conventional water jet or etching processes, the new technique has high productivity and does not degrade the reliability of the IC packages, due to the fact that there is no water or chemical solutions involved in the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.