Yong Lu
12Patents
7h-index
37Co-inventors
62Inventor score
Filing activity: Jun 1, 1995 → Aug 26, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6897118B1 | Method of multiple pulse laser annealing to activate ultra-shallow junctions | Electricity | 60 | Expired |
| US6156654A | Pulsed laser salicidation for fabrication of ultra-thin silicides in sub-quarter micron devices | Electricity | 27 | Expired |
| US6009888A | Photoresist and polymer removal by UV laser aqueous oxidant | Electricity | 26 | Expired |
| US6518540B1 | Method and apparatus for providing ablation-free laser marking on hard disk media | Performing Operations; Transporting | 22 | Expired |
| US5961860A | Pulse laser induced removal of mold flash on integrated circuit packages | Performing Operations; Transporting | 21 | Expired |
| US6576867B1 | Method and apparatus for removal of mold flash | Electricity | 17 | Expired |
| US7501012B2 | Microfibrous entrapment of small reactive particulates and fibers for high contacting efficiency removal of contaminants from gaseous or liquid streams | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6838637B2 | Method and apparatus for deflashing of integrated circuit packages | Performing Operations; Transporting | 5 | Expired |
| US6917011B2 | Method and apparatus for decapping integrated circuit packages | Electricity | 5 | Expired |
| US7108804B2 | Supported nickel catalyst for synthesis gas preparation | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6835319B2 | Method of patterning a substrate | Electricity | 3 | Expired |
| US7170029B2 | Method and apparatus for deflashing of integrated circuit packages | Performing Operations; Transporting | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.