Substrate treating method and apparatus
US5962070A · kind A · utility
51Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1998 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Sep 8, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/3021
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate treating method and apparatus for treating a substrate by supplying a developing solution thereto while spinning the substrate. A nozzle having a plurality of discharge openings for discharging the developer is disposed such that the discharge openings are at different distances from the spin center of the substrate. The developer is discharged from the nozzle while the latter is moved radially of the substrate. The discharge openings then describe loci not overlapping one another over the substrate. The developer is evenly supplied over the substrate to promote the uniformity of development on the substrate surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.