Semiconductor device having simple protective structure and process of fabrication thereof
US5962918A · kind A · utility
22Cited by
7References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 13, 1998 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Oct 13, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device has a protective structure between a semiconductor chip and a ball grid array, and the protective structure has a thin polyimide film bonded to the surface of the semiconductor chip and a thick stress relaxation layer covering conductive strips connected between pads on the surface and the ball grid array; when thermal stress is exerted on the ball grid array, the thick stress relaxation layer allows said ball grid array to move so as to take up the thermal stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.