Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement
US5962926A · kind A · utility
26Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1997 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Sep 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01039
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention comprises a semiconductor device (20) having a active circuit (22) and a bond pad area (24). Within the bond pad area there are a plurality of rows of bond pads. Sets of bond pads (30-36) include one bond pad from each row. The bond pads (26) are uniquely positioned within the bond pad area (24) to allow for a first wire pitch between pads which are adjacent and in the same set, and a second wire pitch between pads which are adjacent and in different sets. A method of determining placement of the bond pads (26) is taught.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.