Laxminarayan Sharma
10Patents
5h-index
9Co-inventors
59Inventor score
Filing activity: Jul 7, 1997 → Nov 9, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5962926A | Semiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placement | Electricity | 26 | Expired |
| US5990547A | Semiconductor device having plated contacts and method thereof | Electricity | 26 | Expired |
| US6566761B1 | Electronic device package with high speed signal interconnect between die pad and external substrate pad | Electricity | 15 | Expired |
| US5898213A | Semiconductor package bond post configuration | Electricity | 14 | Expired |
| US7872356B2 | Die stacking system and method | Electricity | 7 | Active |
| US6574861B1 | System and method for solder ball rework | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7602050B2 | Integrated circuit packaging | Electricity | 2 | Active |
| US9159694B2 | Die stacking system and method | Electricity | 0 | Active |
| US10128170B2 | Conductive clip connection arrangements for semiconductor packages | Electricity | 0 | Active |
| US10490489B2 | Conductive clip connection arrangements for semiconductor packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.