Printed circuit substrate with cavities for encapsulating integrated circuits
US5963429A · kind A · utility
125Cited by
6References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 20, 1997 |
| Grant date | Oct 5, 1999 |
| Priority date | — |
| Expiry date | Aug 20, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed circuit board substrate includes cavities in which electronic components, such as integrated circuits, are mounted and encapsulated. Once the electronic components are encapsulated, other electronic components can be mounted above the encapsulated component on the top surface of the substrate, thereby increasing the number of components that can be mounted to a circuit board of a given area. The encapsulated components are mounted using any one of a variety of techniques. The substrate may include multiple conductive layers for electrically interconnecting the encapsulated components to other components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.