Philip H. Chen
12Patents
5h-index
8Co-inventors
55Inventor score
Filing activity: Aug 20, 1997 → Sep 27, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5963429A | Printed circuit substrate with cavities for encapsulating integrated circuits | Electricity | 125 | Expired |
| US5987358A | Semiconductor device packaging and method of fabrication | Electricity | 97 | Expired |
| US6246587A | Surface mounted device with grooves on a termination lead and methods of assembly | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6251219A | Method and apparatus for use in assembling electronic devices | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6426880B1 | Surface mounted device with grooves on a termination lead | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7833879B2 | Low temperature hermetic bonding at water level and method of bonding for micro display application | Physics | 5 | Active |
| US7585747B1 | Low temperature hermetic bonding at water level and method of bonding for micro display application | Physics | 3 | Active |
| US6406940B1 | Method and apparatus for stacking IC devices | Electricity | 3 | Expired |
| US7344956B2 | Method and device for wafer scale packaging of optical devices using a scribe and break process | Electricity | 3 | Expired |
| US7825519B2 | Method and device for wafer scale packaging of optical devices using a scribe and break process | Electricity | 1 | Active |
| US6182357A | Method and apparatus for dicing electronic substrate | Emerging Cross-Sectional Technologies | 1 | Expired |
| US9006878B2 | Method and device for wafer scale packaging of optical devices using a scribe and break process | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.