Enhanced ceramic ball grid array using in-situ solder stretch with clip

US5964396A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Peter J. Brofman · Hopewell Junction, US
• Patrick A. Coico · Fishkill, US
• Mark G. Courtney · Poughkeepsie, US
• Shaji Farooq · Hopewell Junction, US
• Lewis S. Goldmann · Bedford, US
• Raymond A. Jackson · Poughkeepsie, US
• David C. Linnell · Poughkeepsie, US
• Gregory B. Martin · Wappingers Falls, US
• Frank L. Pompeo · Redding, US
• Kathleen A. Stalter · Hopewell Junction, US
• Hilton T. Toy · Hopewell Junction, US

Key dates

• Filing date: Aug 12, 1997
• Grant date: Oct 12, 1999
• Expiry date: Aug 12, 2017

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.