Adhesive, adhesive film and adhesive-backed metal foil
US5965269A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1997 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Oct 3, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive comprising (1) 100 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 5,000 and a curing agent, (2) 10 to 40 parts by weight of a high-molecular weight component being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, (3) 20 to 100 parts by weight of a high-molecular weight component being incompatible with the epoxy resin and having a weight average molecular weight of 30,000 or above, and (4) 0.1 to 5 parts by weight of a cure accelerator. The adhesive is excellent not only in moisture resistance, heat resistance, adhesive strength at high temperature, heat dissipation, reliability of insulation, crack resistance and flexibility but also in circuit filling and tight adhesion, and exhibits suitable flow properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.