Printed circuit boards for mounting a semiconductor integrated circuit die
US5965944A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Oct 12, 1999 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides printed circuit boards for mounting to a semiconductor integrated circuit die. In one embodiment the printed circuit boards comprise a rigid dielectric substrate having a planar face, a plurality of circuit lines affixed to the face of the substrate, and a plurality of conductive bumps affixed to the face of the substrate. Each conductive bump has an upper bonding surface that is substantially planar and a lateral surface which is essentially perpendicular to the face of the substrate. The conductive bumps and the circuit lines are formed from a single metallic layer. The conductive bumps and circuit lines constitute a unitary, integral structure, i.e., each conductive bump and connecting circuit line lack a physical interface therebetween. The upper surfaces of the conductive bumps extend to essentially the same height above the surface of the substrate, i.e., the upper surfaces of the conductive bumps are substantially coplanar relative to each other. In another embodiment, the printed circuit board further comprises a unitary solder dam or a plurality of unconnected solder dams that partially or completely surround the conductive bumps. The solder …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.