Enhanced ceramic ball grid array using in-situ solder stretch with spring

US5968670A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Peter J. Brofman · Hopewell Junction, US
• Patrick A. Coico · Fishkill, US
• Mark G. Courtney · Poughkeepsie, US
• James H. Covell · Poughkeepsie, US
• Shaji Farooq · Hopewell Junction, US
• Lewis S. Goldmann · Bedford, US
• Raymond A. Jackson · Poughkeepsie, US
• David C. Linnell · Poughkeepsie, US
• Gregory B. Martin · Wappingers Falls, US
• Frank L. Pompeo · Redding, US
• Kathleen A. Stalter · Hopewell Junction, US
• Hilton T. Toy · Hopewell Junction, US

Key dates

• Filing date: Aug 12, 1997
• Grant date: Oct 19, 1999
• Expiry date: Aug 12, 2017

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/12486
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and apparatus are provided for forming an elongated solder joint between two soldered substrates of an electronic module or an electronic module in the process of being fabricated by using expandable solder bump means disposed between the substrates. The expandable solder bumps means comprise solder having a higher reflow temperature than the solder used to join the substrates and expansion means such as a compressed spring encased within the solder and are activated (expanded) by reflowing at a higher temperature than the melting point temperature of the solder joints.