Heating device for semiconductor wafers
US5970214A · kind A · utility
43Cited by
188References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 14, 1998 |
| Grant date | Oct 19, 1999 |
| Priority date | — |
| Expiry date | May 14, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC30B31/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. The light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.