Method and apparatus for removing particles from semiconductor wafer edges using a particle withdrawing means
US5972051A · kind A · utility
3Cited by
29References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1994 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Dec 15, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Discloses is an apparatus and method for cleaning the edges of semiconductor wafers by using a particle withdrawing means having pre-formed, low-tack adhesive material that removes the particles from the edges of the wafers and retains the particles thus removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.