Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier
US5972152A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 16, 1997 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | May 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of fixturing a flexible circuit substrate to a processing carrier are disclosed. In one implementation, the flexible circuit substrate and processing carrier are attached with an adhesive film provided therebetween. The adhesive film comprises acrylic, silicone or a silicone acrylic blend in a preferred embodiment of the present invention. Ideally, substantially the total surface area of a first surface of the flexible circuit substrate is attached to the processing carrier. The flexible circuit substrate is removed from the adhesive film following processing thereof. In a preferred embodiment of the present invention, the adhesive film is monolithic. An electrical component is attached to the flexible circuit substrate and the flexible circuit substrate is encapsulated in accordance with one implementation of the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.