Micromirror for a hybrid optoelectronic integrated circuit, a method for manufacturing the same, a micromirror-photodetector assembly and an assembly of hybrid optoelectronic integrated circuit for receiving light
US5972232A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Dec 3, 1997 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Dec 3, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12104
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a micromirror for a hybrid optoelectronic integrated circuit, a method for manufacturing the same, a micromirror-photodetector assembly and an assembly of hybrid optoelectronic integrated circuit for receiving light. The micromirror the present invention comprises a silicon substrate and at least one V-shaped groove formed in the silicon substrate and the V-shaped groove has an inclined surface reflecting light emitted from an optical waveguide to a photodetector. The alignment of the photodetector and the optical fibers is achieved without an additional attachment equipment, by inserting the optical fibers into the V-groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.