Slurry compositions for polishing wafers used in integrated circuit devices and cleaning compositions for removing electron wax after polishing
US5972863A · kind A · utility
3Cited by
8References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1998 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Mar 12, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Compositions useful for polishing wafers to be used in microelectronic devices comprise silicon dioxide, aluminum oxide, sodium hydroxide, and water. Cleaning compositions for removing electron wax from wafers to be used in microelectronic devices comprise from about 2 to about 6 percent by weight of ammonium hydroxide, from about 10 to about 22 percent by weight of hydrogen peroxide, and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.