Tae-Yeol Heo
6Patents
3h-index
10Co-inventors
46Inventor score
Filing activity: Mar 12, 1998 → Oct 21, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6552337B1 | Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6724474B1 | Wafer surface inspection method | Electricity | 7 | Expired |
| US7258931B2 | Semiconductor wafers having asymmetric edge profiles that facilitate high yield processing by inhibiting particulate contamination | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5972863A | Slurry compositions for polishing wafers used in integrated circuit devices and cleaning compositions for removing electron wax after polishing | Chemistry; Metallurgy | 3 | Expired |
| US6919214B2 | Apparatus for analyzing a substrate employing a copper decoration | Physics | 0 | Expired |
| US6252228A | Method of analyzing morphology of bulk defect and surface defect on semiconductor wafer | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.