Ball grid device with optically transmissive coating
US5973337A · kind A · utility
56Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1997 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Aug 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device (10) coupled to ball grid array substrate (11) and encapsulated by an optically transmissive material (29, 31). The ball grid array substrate (11) has conductive interconnects (14) and a semiconductor receiving area (17) on a top surface and solder pads (13) on a bottom surface. An optoelectronic component (24) is mounted on the semiconductor receiving area (17) and encapsulated with the optically transmissive material (29, 31). Solder balls (18) are formed on the solder pads (13).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.