Semiconductor chip carrier assembly
US5973389A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1997 |
| Grant date | Oct 26, 1999 |
| Priority date | — |
| Expiry date | Apr 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.