Ceramic ball grid array using in-situ solder stretch
US5975409A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1997 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Aug 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus is provided for forming an elongated solder joint between two soldered substrates of an electronic module by applying a controlled separating force between the two soldered substrates during and/or after heating of the module. The solder joints are plasticized, preferably to the molten state above the liquidus temperature, and are thereby stretched and the module is then cooled to solidify the stretched joints. An apparatus and method are provided which preferably uses a vacuum device as the separating force to stretch the existing solder joints to the desired solder height and configuration which is preferably an hour-glass shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.