Removal of fluorine or chlorine residue by liquid CO.sub.2
US5976264A · kind A · utility
95Cited by
25References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 1998 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Nov 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for the removal of fluorine or chlorine residue from an etched precision surface such as a semiconductor sample is provided which comprises exposing said precision surface to liquid CO.sub.2 under appropriate conditions that are sufficient to remove the residue from the precision surface. Cryogenic aerosol may be used in conjunction with liquid CO.sub.2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.