Process for producing chip and pressure sensitive adhesive sheet for said process
US5976691A · kind A · utility
24Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1997 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Dec 17, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2861
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing a chip, comprising the steps of: PA1 a attaching an object to be diced on a pressure sensitive adhesive sheet comprising at least one layer of shrinkable film and a pressure sensitive adhesive layer; PA1 dicing the object into chips, and PA1 shrinking the shrinkable film to thereby reduce an area in which the chips are in contact with the pressure sensitive adhesive. In this process, chips of small thickness and large area can easily be picked up without the need to use a thrust needle in the chip pickup step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.