Method and apparatus providing a mechanical probe structure in an integrated circuit die
US5976980A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 1997 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Sep 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus providing a mechanical probe structure through the back side of an integrated circuit die. In one embodiment, semiconductor substrate is thinned from the back side of the integrated circuit die above a probe target. The probe target is then exposed and a thin insulating layer is formed over the exposed probe target and the nearby semiconductor substrate. The thin insulating layer provides electrical isolation between the exposed probe target and the bulk semiconductor substrate. The thin insulating layer also provides a base insulating platform for a probe pad that is subsequently deposited. After the insulating layer is formed over the exposed probe target and the nearby semiconductor substrate, the probe target is re-exposed through insulating layer such that a probe pad may be deposited over the probe target to provide electrical contact to the original probe target as well as provide a probe pad for mechanical probing purposes from the back side of the integrated circuit die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.